Metallization, material selection, and bonding of interconnections for novel LTCC and HTCC power modules

Sešek, Aleksander (author), Makarovič, Kostja (author)

Ceramic baseplates are important elements in the power modules of electric drives. This paper presents low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) materials for the fabrication of three-dimensional power modules. The silver-based metallization and power module assembly are presented, together with aluminum-based power wire bonding and an industrial procedure to achieve high solderability and bondability. The results of the bond tests using different metallization materials, especially cost-effective ones, are presented, together with the assembly of the power modules. The best results were achieved with Ag metallization and 380 µm Al wire and with Ag–Pd metallization and 25 µm Al wire, both on an LTCC base. The paper concludes with a dual-pulse electrical test of the power modules, which proves the quality of metallization, the type of material selected, and the correctness of the wire bonding and assembly.

• Language: English
• Keywords: power modules, LTCC baseplate, 3D LTCC structures, power bonds
• Work type: Article
• Typology: 1.01 - Original Scientific Article
• Organization: FE - Faculty of Electrical Engineering
• Publication status: Published
• Publication version: Version of Record
• Year: 2022
• Number of pages: 13 str.
• Numbering: Vol. 15, iss. 3, art. 1036
• PID: 20.500.12556/RUL-137023
• UDC: 620.1/.2
• ISSN on article: 1996-1944
• DOI: 10.3390/ma15031036
• COBISS.SI-ID: 95619587
• Publication date in RUL: 30.05.2022

Record is a part of a journal

• Title: Materials
• Shortened title: Materials
• Publisher: MDPI
• ISSN: 1996-1944
• COBISS.SI-ID: 33588485

Licences

• License: CC BY 4.0, Creative Commons Attribution 4.0 International
• Link: http://creativecommons.org/licenses/by/4.0/
• Description: This is the standard Creative Commons license that gives others maximum freedom to do what they want with the work as long as they credit the author.
• Licensing start date: 01.02.2022

Secondary language

• Language: Slovenian
• Keywords: močnostni moduli, LTCC osnovna plošča, 3D LTCC strukture, močnostne povezave