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Metallization, material selection, and bonding of interconnections for novel LTCC and HTCC power modules
ID
Sešek, Aleksander
(
Author
),
ID
Makarovič, Kostja
(
Author
)
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MD5: 1C720BB96C04448E9558DF593351BF58
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https://www.mdpi.com/1996-1944/15/3/1036
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Abstract
Ceramic baseplates are important elements in the power modules of electric drives. This paper presents low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) materials for the fabrication of three-dimensional power modules. The silver-based metallization and power module assembly are presented, together with aluminum-based power wire bonding and an industrial procedure to achieve high solderability and bondability. The results of the bond tests using different metallization materials, especially cost-effective ones, are presented, together with the assembly of the power modules. The best results were achieved with Ag metallization and 380 µm Al wire and with Ag–Pd metallization and 25 µm Al wire, both on an LTCC base. The paper concludes with a dual-pulse electrical test of the power modules, which proves the quality of metallization, the type of material selected, and the correctness of the wire bonding and assembly.
Language:
English
Keywords:
power modules
,
LTCC baseplate
,
3D LTCC structures
,
power bonds
Work type:
Article
Typology:
1.01 - Original Scientific Article
Organization:
FE - Faculty of Electrical Engineering
Publication status:
Published
Publication version:
Version of Record
Year:
2022
Number of pages:
13 str.
Numbering:
Vol. 15, iss. 3, art. 1036
PID:
20.500.12556/RUL-137023
UDC:
620.1/.2
ISSN on article:
1996-1944
DOI:
10.3390/ma15031036
COBISS.SI-ID:
95619587
Publication date in RUL:
30.05.2022
Views:
610
Downloads:
121
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Record is a part of a journal
Title:
Materials
Shortened title:
Materials
Publisher:
Molecular Diversity Preservation International
ISSN:
1996-1944
COBISS.SI-ID:
33588485
Licences
License:
CC BY 4.0, Creative Commons Attribution 4.0 International
Link:
http://creativecommons.org/licenses/by/4.0/
Description:
This is the standard Creative Commons license that gives others maximum freedom to do what they want with the work as long as they credit the author.
Licensing start date:
01.02.2022
Secondary language
Language:
Slovenian
Keywords:
močnostni moduli
,
LTCC osnovna plošča
,
3D LTCC strukture
,
močnostne povezave
Projects
Funder:
ARRS - Slovenian Research Agency
Project number:
P2-0105
Name:
Elektronska keramika, nano, 2D in 3D strukture
Funder:
ARRS - Slovenian Research Agency
Project number:
P2-0257
Name:
Sistemi na čipu z integriranimi mikromehanskimi, s THz, z magnetnimi in z elektrokemijskimi senzorji
Funder:
EC - European Commission
Funding programme:
SLO-AUT INTERREG
Acronym:
ASAM
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