20.500.12556/RUL-137023 Metallization, material selection, and bonding of interconnections for novel LTCC and HTCC power modules Ceramic baseplates are important elements in the power modules of electric drives. This paper presents low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) materials for the fabrication of three-dimensional power modules. The silver-based metallization and power module assembly are presented, together with aluminum-based power wire bonding and an industrial procedure to achieve high solderability and bondability. The results of the bond tests using different metallization materials, especially cost-effective ones, are presented, together with the assembly of the power modules. The best results were achieved with Ag metallization and 380 µm Al wire and with Ag–Pd metallization and 25 µm Al wire, both on an LTCC base. The paper concludes with a dual-pulse electrical test of the power modules, which proves the quality of metallization, the type of material selected, and the correctness of the wire bonding and assembly. power modules LTCC baseplate 3D LTCC structures power bonds močnostni moduli LTCC osnovna plošča 3D LTCC strukture močnostne povezave true false true Angleški jezik Slovenski jezik Članek v reviji 2022-05-30 08:04:53 2022-05-30 08:04:55 2022-09-15 04:14:35 0000-00-00 00:00:00 2022 0 0 13 str. iss. 3, art. 1036 Vol. 15 Feb. 2022 0000-00-00 Zaloznikova Objavljeno NiDoloceno 0000-00-00 0000-00-00 0000-00-00 620.1/.2 1996-1944 10.3390/ma15031036 95619587 materials-15-01036-v2.pdf materials-15-01036-v2.pdf 1 1C720BB96C04448E9558DF593351BF58 5d7b5be26f6cba7a0830e13e9c6d063ed600bb1fb495abe0f209974e314eee57 93a2a5c5-dfde-11ec-8aca-00155dcfd717 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=156873 https://www.mdpi.com/1996-1944/15/3/1036 0 651f5f49-dfde-11ec-8aca-00155dcfd717 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=156872 Fakulteta za elektrotehniko 0 0 0