In this thesis the aim was to create a bond between an aluminum and copper specimen through diffusion bonding. The cylindrical shaped specimens were bonded at various temperatures and times. The interface of the joined couple was analysed by optical microscopy and field emisson scanning electron microscopy. An EDS analyse of the chemical composition was made on the couples interface. The size of the joint and the the present intermetalic layers size were messured (CuAl2, CuAl, Cu12Al9 in Cu9Al4). All the joined samples were cracked through the eutectic layer, except in some cases there were present local joints. The influence of tempreture and time on the size of the joint and the size of the present intermetalic layers were examinate.