In the thesis the influence of press temperature on the curing of the phenol-formaldehyde (PF) adhesive bond has been investigated. A PF adhesive for plywood and beech veneer (Fagus sylvatica L.) were used. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and dielectric analysis (DEA) were applied in order to observe the cure kinetics of the PF adhesive. The dynamics of the bond strength development (DBSD) of the PF adhesive bond on a two-ply specimen of peeled veneer were observed on a modified Automated Bonding Evaluation System (ABES). The DSC results showed that the majority of the reaction, which revealed energy, occurred between 135 °C and 160 °C. The results of DMA at increasing temperatures were dependent upon the mechanical response of wood, and also upon the curing of the PF adhesive. DEA and DBSD were performed in a miniature hot-press at different press temperatures (140 °C, 160 °C, 180 °C and 200 °C). The DEA measurements were carried out using a fringe field IDEX sensor, embedded in the PF adhesive layer, and connected to a LCR Meter, at three different frequencies. It was found that the degree of cure, calculated from the conductivity data, depends on the pressing time and the temperature. When the temperature is increased the curing of the PF adhesive begins earlier, and the speed of curing increases, so that the desired degree of cure is achieved faster. By means of a statistical analysis of the cure kinetics results it was found that the Gompertz function is best able to define empirically the degree of cure vs. time. Results of DBSD showed that shear strength and wood failure of the PF adhesive bond depend on pressing time and temperature. At higher pressing temperatures the shear strength develops faster. This was mathematically described by means of a three-parameter logistic function. The relationship between DBSD and DEA can be described by a power equation, which is, however, only relevant for the observed PF adhesive and the pressing conditions used.