In the modern world, increasingly powerful electronic devices are also becoming more space-efficient. During operation, excess heat is generated, which must be dissipated to prevent overheating. Various cooling systems exist for this purpose, among which the field of vapor chambers is rapidly developing. Due to space efficiency, these are becoming smaller and smaller. To test and develop ultra-thin vapor chambers, a precise filling system is required. In this thesis, we conducted a review of existing vapor chamber filling systems and developed our own system. We measured the dimensions of ultra-thin vapor chambers and tested their leak tightness. After sealing, the system was first tested on simulation tubes, and subsequently, the vapor chambers were filled to a specified charge ratio. Following this, they were tested with a heat source to determine whether the vapor chambers functioned properly. The filling system operates successfully, and a noticeable difference in performance was observed between vapor chambers with different charge ratios. However, there is still room for improvement in the system.
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