Increasing thermal loads in electronic components demands the development of advanced heat sinks that outperform conventional geometries. The thesis focuses on the development and numerical verification of cooling structures designed through topology and parametric optimization, aimed at achieving maximum thermal efficiency while reducing overall mass. Using Ansys and nTop, complex geometries were generated, including Diamond, Schwarz, and Gyroid periodic structures. The methodology involves steady-state thermal analysis, comparing numerical results with standard solutions and experimental measurements of a 3D-printed prototype. Findings reveal that optimized structures improve material distribution relative to the heat source, though efficiency remains highly dependent on the ratio between convective surface area and flow resistance. The characteristic length significantly affects the Rayleigh number, which scales with the cube of charecteristic length. At short characteristic lengths, the Rayleigh number is very low, resulting in a laminar, slow flow, and consequently a low Nusselt number and a low natural convection coefficient. The results confirm that the integration of advanced algorithms and additive manufacturing technologies enables the production of a new generation of lightweight and highly efficient cooling systems for industrial applications, with high performance and efficiency exceeding 95% at higher heat input levels.
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