We want to use a new silicone adhesive that will bond a circuit board on a copper plate to an aluminum heat sink. The key properties of the adhesive are that it conducts heat well, is electrically insulating and has good mechanical properties. With the task, we wanted to determine whether the thermomechanical loading to which the product will be subjected affects the bonded joint or the adhesive. We designed a test specimen with three different adhesive layer thicknesses, prepared test sites for measuring key properties, exposed the test specimen to cyclic thermomechanical loads and statistically evaluated the data. The findings show that thermomechanical aging affects the properties of the adhesive, with the thickness of the adhesive layer also having an impact. Most properties deteriorate slightly, and in some cases they even improve. This confirms that the adhesive is very suitable for the selected task.
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