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Spremljanje utrjevanja lepila z dielektrično analizo
ID Šernek, Milan (Author)

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Abstract
Namen spremljanja utrjevanja lepila je ugotoviti optimalen čas lepljenja. Utrjevanje lepila je mogoče proučevati z različnimi analitskimi metodami (DSC,DMA, DTA), vendar le v laboratorijskih pogojih, težje pa v realnih pogojih pri visoki temperaturi in tlaku med lepljenjem v stiskalnici. Razvitihje nekaj metod za spremljanje utrjevanja lepila v industrijski proizvodnji; najbolj obetajoča je dielektrična analiza, ki je predstavljena v prispevku. Pojasnjen je način merjenja in model za kinetiko utrjevanja lepila.Prikazani so rezultati dielektrične analize pri lepljenju z urea-formaldehidnim lepilom.

Language:Slovenian
Keywords:UF lepilo, utrjevanje lepila, dielektrične lastnosti, stopnja utrjenosti
Work type:Not categorized (r6)
Typology:1.01 - Original Scientific Article
Organization:BF - Biotechnical Faculty
Year:2004
Publisher:Zveza društev inženirjev in tehnikov gozdarstva in lesarstva Slovenije
Number of pages:Str. 404-408
Numbering:Let. 56, št. 12
UDC:630*824.8:630*824.834
ISSN on article:0024-1067
COBISS.SI-ID:1251977 This link opens in a new window
Publication date in RUL:10.07.2015
Views:740
Downloads:168
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Record is a part of a journal

Title:Les
Shortened title:Les
Publisher:Zveza društev inženirjev in tehnikov gozdarstva in lesarstva Slovenije, Zveza društev inženirjev in tehnikov gozdarstva in lesarstva Slovenije, Biotehniška fakulteta, Oddelek za lesarstvo, Založba Univerze, Biotehniška fakulteta, Oddelek za lesarstvo
ISSN:0024-1067
COBISS.SI-ID:13940224 This link opens in a new window

Secondary language

Language:English
Title:Dielectric monitoring of adhesive cure
Abstract:
Adhesive cure monitoring is carried out for optimizing press schedule. Several analytical techniques are available for monitoring the cure of an adhesive (DSC, DMA, DTA), but not many could be successfully applied in industrial environment. A few methods have been developed for in-process purpose and most promising is dielectric analysis, which allows continuous in situ measurements. This article presents principles of dielectric analysis and describes a model for adhesive cure kinetics. The results of monitoring the cure of urea-formaldehyde adhesive are shown.

Keywords:UF adhesive, adhesive cure, dielectric properties, degree of cure

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