The impact of adhesive type and its share in forming density profile at making of particle boards was researched. Industrial particles were blended with urea-formaldehyde and melamine-formaldehyde resin. Particleboards were made in laboratory conditions with 6.00 - 9.00 % share of glue in the core layer, and 10.00 - 13.00 % in the surface layer. During pressing the temperature change was measured in the middle of the particleboard, between intersection core and surface layer, and between surface layer and heating plate. Density profile was appointed by a measuring procedure of density distribution, using instrument MGP-201 for measuring of density profiles. It was found out that the type of adhesive does not influence temperature increase in CL, so as that the glue alone does not influence the change of density profile. Enlarging the gluing factor influences the speed of warming, and therefore, as a consequence, the change of density profile.