Vpliv izbranega lepila na gostotni profil pri izdelavi ivernih plošč : diplomsko delo - univerzitetni študij

Kužnik, Dominik (author), Medved, Sergej (mentor), Gornik Bučar, Dominika (reviewer)

Raziskali smo vpliv vrste ter deleža lepila na nastanek gostotnega profila pri izdelavi ivernih plošč. Za izdelavo smo uporabili industrijsko iverje ter UF- oziroma MF-lepilo. Plošče smo izdelali pri laboratorijskih pogojih s 6,00-9,00 % deleža lepila v srednjem in z 10,00-13,00 % v zunanjem sloju. Med stiskanjem smo merili spremembo temperature v sredini plošče, med zunanjim in srednjim slojem plošče ter med iverno in grelno ploščo stiskalnice. Gostotni profil smo določevali z metodo merjenja porazdelitve gostote, za kar smo uporabili merilnik gostotnih profilov MGP-201. Ugotovili smo, da vrsta lepila ne vpliva na prehod toplote med posameznimi ploščami in da z lepilom ne vplivamo na spremembo gostotnega profila. S povečanjem faktorja oblepljanja vplivamo na hitrost segrevanja in s tem posledično na spremembo gostotnega profila.

• Language: Slovenian
• Keywords: iverna plošča, UF lepilo, MF lepilo, gostotni profil
• Work type: Undergraduate thesis
• Typology: 2.11 - Undergraduate Thesis
• Organization: BF - Biotechnical Faculty
• Place of publishing: Ljubljana
• Publisher: [D. Kužnik]
• Year: 2009
• Number of pages: VIII, 52 f.
• PID: 20.500.12556/RUL-457
• UDC: 630*862.2
• COBISS.SI-ID: 1779593
• Publication date in RUL: 11.07.2014

Secondary language

• Language: English
• Title: Impact of adhesive type on density profile at particle board making : graduation thesis - university studies

Abstract

The impact of adhesive type and its share in forming density profile at making of particle boards was researched. Industrial particles were blended with urea-formaldehyde and melamine-formaldehyde resin. Particleboards were made in laboratory conditions with 6.00 - 9.00 % share of glue in the core layer, and 10.00 - 13.00 % in the surface layer. During pressing the temperature change was measured in the middle of the particleboard, between intersection core and surface layer, and between surface layer and heating plate. Density profile was appointed by a measuring procedure of density distribution, using instrument MGP-201 for measuring of density profiles. It was found out that the type of adhesive does not influence temperature increase in CL, so as that the glue alone does not influence the change of density profile. Enlarging the gluing factor influences the speed of warming, and therefore, as a consequence, the change of density profile.

• Keywords: particleboard, UF resin, MF resin, density profile