With the miniaturization of electronic circuits and increase in their performance, the need for waste heat dissipation is increasing. In the future, the current air and water cooling technologies will no longer be able to keep up. We need to find new solutions that will use latent heat. As part of this task, an experimental and theoretical analysis of two miniature cooling systems was performed. The first on the basis of steam-compression and the second on the basis of pumped-evaporative cooling. Experimental results have shown that the latter is able to dissipate 3 times the amount of heat based on the same mass flow compared to water cooling.