In the thesis the influence of temperature on the curing speed of epoxy adhesive Xepox 40 has been researched. Oscillation tests were performed on the rheometer to study the rheological properties of the epoxy adhesive. »Multiwave oscillation« test was used to study the influence of temperature (20 °C, 30 °C, 40 °C and 50 °C) and the influence of deviation from the recommended two-component volume ratio on the curing speed of the epoxy adhesive. In addition to the recommended volume ratio 100:50, ratios 100:40 and 100:60 were also tested. Gel time and vitrification time were determined for each measurement. It was found that the curing speed of the epoxy adhesive increased with increasing the temperature. Adding less hardener made the adhesive cure slower, while adding more hardener increased the curing speed of the adhesive.