Mikrostrukturne in mehanske lastnosti Al-Cu zvarnih spojev

Čurila, Sven (author)

Cilj diplomske naloge je bil doseči zvarni spoj med aluminijem in bakrom z difuzijo. Vzorci cilindrične oblike so se spajali pri različnih temperaturah in časih. Spojeni vzorci so se analizirali s svetlobno in elektronsko vrstično mikroskopijo. Na zvarnem spoju se je izvajala EDS analiza kemijske sestave. Merila se je velikost spoja in velikost prisotnih plasti intermetalnih plasti (CuAl2, CuAl, Cu12Al9 in Cu9Al4). Pri vseh spojih so bile prisotne razpoke, ki so potekale skozi evtektik, razen v nekaterih primerih, kjer so bili prisotni lokalni spoji. Ugotavljal se je vpliv temperature in časa na velikost spoja in velikost intermetalnih plasteh.

• Language: Slovenian
• Keywords: difuzija, difuzijsko spajanje, baker, aluminij, intermetalne spojine
• Work type: Bachelor thesis/paper
• Organization: NTF - Faculty of Natural Sciences and Engineering
• Year: 2017
• PID: 20.500.12556/RUL-96354
• Publication date in RUL: 29.09.2017

ČURILA, Sven, 2017, Mikrostrukturne in mehanske lastnosti Al-Cu zvarnih spojev [online]. Bachelor’s thesis. [Accessed 21 March 2025]. Retrieved from: https://repozitorij.uni-lj.si/IzpisGradiva.php?lang=eng&id=96354

Secondary language

• Language: English
• Title: Microstructural and mechanical properties of Cu-Al welded joints

Abstract

In this thesis the aim was to create a bond between an aluminum and copper specimen through diffusion bonding. The cylindrical shaped specimens were bonded at various temperatures and times. The interface of the joined couple was analysed by optical microscopy and field emisson scanning electron microscopy. An EDS analyse of the chemical composition was made on the couples interface. The size of the joint and the the present intermetalic layers size were messured (CuAl2, CuAl, Cu12Al9 in Cu9Al4). All the joined samples were cracked through the eutectic layer, except in some cases there were present local joints. The influence of tempreture and time on the size of the joint and the size of the present intermetalic layers were examinate.

• Keywords: diffusion, diffusion bonding, copper, aluminum, intermetalic compounds