Shear strength development of the phenol-formaldehyde adhesive bond during cure
Jošt, Matej (Author), Šernek, Milan (Author)

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The development of the shear strength of the phenol-formaldehyde (PF) adhesive bond during curing was investigated. Five different PF adhesive mixtures and 1.1 mm thick peeled beech (Fagus sylvatica L.) veneer were used to produce lap-shear specimens, which were cured at a pressing temperature of C. Dielectric analysis (DEA) and modified ABES (automated bonding evaluation system) were used to evaluate the physical-chemical and mechanical aspects of PF adhesive cure in a miniature hot-press. The degree of cure, which was calculated from conductivity data, was dependent on pressing time and the composition of the PF adhesive. An addition of rye flour to the PF adhesive significantly postponed the curing process as determined by DEA. It was found that the adhesive bond started to develop in the last stage of the curing (vitrification), by which time most of the physical-chemical conversion of the adhesive had been completed.

Keywords:phenol, wood, shear strength, DEA, ABES, fenol, les, strižna trdnost
Tipology:1.01 - Original Scientific Article
Organization:BF - Biotechnical Faculty
Number of pages:Str. 153-166
Numbering:Vol. 43, no. 1/2
ISSN on article:0043-7719
COBISS.SI-ID:1662089 This link opens in a new window
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Record is a part of a journal

Title:Wood Science and Technology
Shortened title:Wood Sci. Technol.
COBISS.SI-ID:9151749 This link opens in a new window

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