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Shear strength development of the phenol-formaldehyde adhesive bond during cure
ID Jošt, Matej (Author), ID Šernek, Milan (Author)

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PID: 20.500.12556/rul/58029a0d-a31c-43bd-8565-17b6e0b407ca

Abstract
The development of the shear strength of the phenol-formaldehyde (PF) adhesive bond during curing was investigated. Five different PF adhesive mixtures and 1.1 mm thick peeled beech (Fagus sylvatica L.) veneer were used to produce lap-shear specimens, which were cured at a pressing temperature of C. Dielectric analysis (DEA) and modified ABES (automated bonding evaluation system) were used to evaluate the physical-chemical and mechanical aspects of PF adhesive cure in a miniature hot-press. The degree of cure, which was calculated from conductivity data, was dependent on pressing time and the composition of the PF adhesive. An addition of rye flour to the PF adhesive significantly postponed the curing process as determined by DEA. It was found that the adhesive bond started to develop in the last stage of the curing (vitrification), by which time most of the physical-chemical conversion of the adhesive had been completed.

Language:English
Keywords:phenol, wood, shear strength, DEA, ABES, fenol, les, strižna trdnost
Typology:1.01 - Original Scientific Article
Organization:BF - Biotechnical Faculty
Year:2009
Number of pages:Str. 153-166
Numbering:Vol. 43, no. 1/2
PID:20.500.12556/RUL-92879 This link opens in a new window
UDC:630*824.83
ISSN on article:0043-7719
COBISS.SI-ID:1662089 This link opens in a new window
Publication date in RUL:06.07.2017
Views:1795
Downloads:598
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Record is a part of a journal

Title:Wood science and technology
Shortened title:Wood sci. technol.
Publisher:Springer Nature, International Academy of Wood Science
ISSN:0043-7719
COBISS.SI-ID:9151749 This link opens in a new window

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