Primerjava termičnih lastnosti materialov za tiskana vezja za aplikacije s svetlečimi diodami

ANZELJC, DEJAN (author), Jankovec, Marko (mentor)

Diplomsko delo predstavlja analizo lastnosti odvajanja toplote različnih materialov in izvedenk tiskanih vezij za aplikacije svetil iz svetlečih diod. Uporabljene so izvedenke materiala FR4 brez vij, kot tudi z različnim številom vij pod svetlečo diodo, CEM3 ter IMS na aluminijasti in bakreni osnovi. Toplotne razmere teh vezij so analizirane na več načinov, v enakem zaporedju, kot se uporablja v praksi v podjetju Hella Saturnus Slovenija d.o.o. pri razvoju tiskanih vezij za svetila v avtomobilski industriji. Najprej so vsa vezja simulirana v treh različnih simulacijskih orodjih, z namenom analize vezij in primerjave rezultatov med simulacijskimi orodji. Naslednji korak je analiza s termokamero, katere namen je določiti vroče komponente, oziroma točke na vezju, na katerih se potem opravi meritev temperature. Kot zadnji del analize so dodane še meritve na fizičnih vzorcih, pri različnih temperaturnih obremenitvah. Namen je preveriti obnašanje pod različnimi obremenitvami ter ugotavljanje ustreznosti uporabe vezja v določeni aplikaciji. V zaključku diplomskega dela je narejena še primerjava rezultatov simulacij in meritev. Predstavljene so še nekatere druge izvedenke tiskanih vezji s poudarkom na hlajenju.

• Language: Slovenian
• Keywords: Simulacije, termografija in meritve različnih materialov tiskanih vezij. Analiza in primerjava rezultatov.
• Work type: Undergraduate thesis
• Organization: FE - Faculty of Electrical Engineering
• Year: 2016
• PID: 20.500.12556/RUL-82767
• Publication date in RUL: 23.05.2016

Secondary language

• Language: English
• Title: Comparison of thermal properties of printed circuit board materials for light emitting diodes applications

Abstract

The diploma thesis deals with heat dissipation analysis of different printed circuit board materials in different configuration. Several FR4 material versions are used: basic version without vias and also 3 additional versions with different numbers of vias. In addition, there are also CEM3 and two versions of insulated metal substrate (IMS) boards: copper and on aluminium base plate. Thermal behaviour is analysed in many ways, as it is used in praxis during development of printed circuit boards for lamps for automotive industry in company Hella Saturnus Slovenija d.o.o. At first all boards are simulated in three different simulation programs, with the purpose of board analysis and comparison of simulation results between the programs. Next step is the thermal camera analysis to find out where the hot spots are and to define points for thermocouple measurement. Last part of analysis is a thermocouple measurement on physical parts at different thermal loads with the purpose to check the behaviour at different thermal stresses and determination of applicability in specific applications. Also some other versions of printed circuit boards with a focus on cooling are presented.

• Keywords: Simulations, thermography and measurements of different printed circuit board materials. Analysis and comparison of results.