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Poškodbe tiskanih vezij pri proizvodnji svetlobne opreme
ŽIBERT, ANA (Author), Žemva, Andrej (Mentor) More about this mentor... This link opens in a new window

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Abstract
Diplomsko delo opisuje, kako lahko poškodujemo tiskana vezja v večjem proizvodnem prostoru in kakšne prijeme uporabljamo, da take poškodbe zmanjšamo. Opisan je tudi preizkus upognjenosti vezja, kjer na določena vezja namestimo merilne rozete, preko katerih pomerimo upognjenost vezja med sestavo izdelka. Poškodbe sem v grobem ločila na mehanske in elektrostatične. Pod mehanske poškodbe štejem tiste poškodbe, ki nastanejo predvsem zaradi upogibanja in neprimernega ravnanja z vezji. Pri sestavljanju izdelka uporabljamo pripomočke, kot so električni vijačniki, s katerimi vijačimo tiskana vezja na druge komponente. Pri tem lahko uporabimo prevelik navor in preveliko število vrtljajev, kar lahko privede do upogibanja tiskanega vezja. Z upogibanjem pa lahko poškodujemo bakrene povezave in elemente na plošči. V ta namen je bil opravljen preizkus, kjer smo preverili, če se med izdelavo nekega izdelka tiskano vezje preveč upogne. Elektrostatične poškodbe so posledica elektrostatične razelektritve. Če delamo z elektrostatično občutljivimi elementi, moramo imeti temu primeren prostor in opremo. Take poškodbe zelo težko zaznamo s prostim očesom. Velikokrat se zgodi, da izdelek poškodujemo do te mere, da prestane končno kontrolo in preneha z delovanjem šele pri kupcu. Raziskala sem, v kakšnem prostoru lahko delamo s tiskanimi vezji, kakšna mora biti naša osebna oprema in v kakšno embalažo lahko pakiramo električno občutljive komponente.

Language:Slovenian
Keywords:Tiskana vezja, mehanske poškodbe, elektrostatične poškodbe, ESD meritve, merjenje upognjenosti, EPA prostor, ESD embalaža
Work type:Bachelor thesis/paper (mb11)
Organization:FE - Faculty of Electrical Engineering
Year:2016
Views:734
Downloads:301
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Secondary language

Language:English
Title:Damages of printed circuits in lighting equipment manufacturing
Abstract:
The thesis describes how the printed circuit boards (PCBs) can be damaged in a production process and how that damage can be reduced. The thesis also describes the strain gauge test where several gauges were attached to the PCB. Possible damages are split into two groups - mechanical and electrostatic. Mechanical damages mostly commonly occur due to bending of circuit board. During assembly process, several different tools (e.g., electrical screwdrivers) are used to assemble the parts together. During the process of screwing the PCB to the mating part, the screwing torque could be too high or the number of rotations could be too numerous. Both pose a threath of damaging the PCB. During flexing of the PCBs one could damage copper connections and/or elements on boards. Strain gauge experiment was conducted to check for overflexing of the PCB during assembly process. Electrostatic damages are a result of elecrostatic discharge. When working with electrostatic sensitive devices, electostatic discharge protected area and tools are required. Electrostatic damages are very hard to detect. The thesis presents what kind of area is required to assemble the PCBs and what kind of packaging one should use.

Keywords:printed circut board, ESD, mechanical damage, ESD damage, strain gauge, EPA area, ESD packaging

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