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Vpliv vlažnosti lesnih plošč na emisijo formaldehida : diplomski projekt
ID Sašek, Dejan (Author), ID Medved, Sergej (Mentor) More about this mentor... This link opens in a new window, ID Šernek, Milan (Reviewer)

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PID: 20.500.12556/dkum/95844a59-350d-45d7-bce4-2a50e62a17ca

Abstract
Uporaba lesnih ploščnih kompozitov je zelo razširjena, saj je iz njih narejena večina pohištva. Kar 95 % lesnih ploščnih kompozitov je zlepljenih s poli-kondenzacijskimi lepili, pri katerih je formaldehid pomembna spojina, ki kasneje počasi iz izdelka emitira v okolje. Hitrost emisije je odvisna od številnih dejavnikov kot npr. deleža in vrste lepila, zgradbe plošče, gostote plošče in vsebnosti vlage, oz. okolja kateremu je izdelek izpostavljen. Raziskovali smo vpliv relativne zračne vlažnosti na emisijo formaldehida. Za testiranje smo izbrali 3-slojne iverne plošče. Izpostavili smo jih različnim relativnim vlažnostim pri konstantni temperaturi 20 °C. Razpon vlažnosti se je gibal od 0 % in pa do 87 % relativne zračne vlažnosti. Za referenčno vrednost smo izbrali plošče izpostavljene okolju s 65 % relativne zračne vlažnosti. Emisijo prostega formaldehida smo izmerili po steklenični metodi. Prav tako smo raziskovali emisijo po pretečenem daljšem časovnem obdobju. Ugotovili smo, da je prišlo do povečane emisije pri absolutno suhih vzorcih in vzorcih izpostavljenih 87 % relativni zračni vlažnosti. Emisija se je čez čas zmanjšala in izenačila pri vseh vzorcih.

Language:Slovenian
Keywords:vlažnost, iverne plošče, prosti formaldehid, emisija
Work type:Bachelor thesis/paper (mb11)
Typology:2.11 - Undergraduate Thesis
Organization:BF - Biotechnical Faculty
Year:2012
Publisher:[D. Sašek]
Number of pages:VI, 19 f.
Place:Ljubljana
PID:20.500.12556/RUL-686 This link opens in a new window
UDC:630*862.2
COBISS.SI-ID:2048393 This link opens in a new window
Publication date in RUL:11.07.2014
Views:870
Downloads:234
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Secondary language

Language:English
Title:Impact of moisture content of particleboards on formaldehyde emission : B. Sc. thesis
Abstract:
The use of wood based panels is widespread due to the fact that most of the furniture is made from these products. Almost 95 % of wood based panels are made using polycondensational adhesives. Formaldehyde is a major component in these adhesives, and any unbound formaldehyde will emit from wood based panels that have been made using the aforementioned adhesives. The emission rate of formaldehyde depends on the type and amount of adhesive used, density of the panel and the moisture content of the product or the environment surrounding it. For the experiment we took commercially available 3-layered particle boards and exposed them to different levels of humidity at a constant temperature of 20 °C. The levels of humidity ranged from absolutely dry to 87 %. The reference humidity level was at 65 %. The emission of free formaldehyde was measured using the WKI flask method. We also looked at what happens to formaldehyde emissions after a prolonged period of time. We found that both high (87 %) and extremely low humidity increased the emission rate of free formaldehyde. After a prolonged period of time, the free formaldehyde emissions decreased and eventually equalized in all samples.

Keywords:humidity, particle board, free formaldehyde, emission

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