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Vpliv vrste lepila pri izdelavi ivernih plošč na tlak sproščanja ob izpostavitvi delovanju vode : diplomsko delo
Firšt, Uroš (Author), Medved, Sergej (Mentor) More about this mentor... This link opens in a new window, Gornik Bučar, Dominika (Reviewer)

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Abstract
Raziskali smo vpliv vrste in deleža lepila na debelinski nabrek in tlak sproščanja pri nabreku. Za izdelavo plošč smo uporabili iverje iz tovarne Otiški Vrh, UF in MF lepilo. Plošče smo izdelali pri laboratorijskih pogojih s 6,00 % do 9,00 % deleži lepila v srednjem sloju ter 10,00 % do 13,00 % v zunanjem. Med stiskanjem smo merili spremembo temperature v sredini plošče, v prehodu med zunanjim in srednjim slojem ter prehodom med iverno in grelno ploščo stiskalnice. Debelinski nabrek smo določevali z metodo 24 urne potopitve preizkušancev v vodo. Silo oz. tlak sproščanja ob potopitvi smo merili 24 ur. Ugotovili smo, da imajo plošče zlepljene z melamin-formaldehidnim lepilom manjši debelinski nabrek kot tiste zlepljene z urea-formaldehidnim. Pri uporabi melamin-formaldehidnega lepila smo prav tako ugotovili manjše sile, ki se sprostijo ob nabrekanju. Z manjšanjem debelinskega nabreka se manjša tudi sila (tlak sproščanja ob nabreku). Pri UF lepilu smo dosegli večje spremembe sile (tlak sproščanja ob nabreku) pri spreminjanju deleža lepila v srednjem sloju. Sila (tlak sproščanja ob nabreku) in debelinski nabrek hitreje naraščata v začetni fazi izpostavitve vodi.

Language:Slovenian
Keywords:iverne plošče, UF lepilo, MF lepilo, debelinski nabrek, sila nabreka
Work type:Undergraduate thesis (m5)
Tipology:2.11 - Undergraduate Thesis
Organization:BF - Biotechnical Faculty
Year:2008
Publisher:[U. Firšt]
Number of pages:VIII, 45 f.
Place:Ljubljana
UDC:630*862.2:630*824.86
COBISS.SI-ID:1619081 Link is opened in a new window
Views:879
Downloads:214
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Secondary language

Language:English
Title:Impact of adhesive type at particleboard manufacturing at pressure relax when exposed to water activity : univerzitetni študij
Abstract:
The impact of adhesive type and its share on swelling stress and thickness swelling of particleboards was researched. To make particleboards particles from Otiški Vrh Particleboard Factory were glued with urea-formaldehyde or melamine-formaldehyde resin. Particleboards were made in laboratory conditions with 6.00 % - 9.00 % share of glue in the core layer, and 10.00 % - 13.00 % in the surface layer. During the compression the temperature change was measured in the middle of the particleboard, intersection core and surface layer, and in intersection between surface layer and heating plate. Thickness swelling was determined with 24 hour water immersion test. Swelling stresses were measured for 24 hours. It was determined that particleboards glued with MF resin had lower thickness swelling than those glued with UF resin. Particleboards glued with MF resin had a lower swelling stress. It was also determined that by reducing the thickness swelling the swelling stress reduces too. Using UF resin we achieved bigger changes of swelling stress by changing the share of glue in core layer. Swelling stress and thickness swelling increase faster in 1st. phase when exposed to water.

Keywords:particleboard, UF resin, MF resin, thickness swelling, swelling stress

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