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TCCbuilder : an open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits
ID
Vozel, Katja
(
Author
),
ID
Klinar, Katja
(
Author
),
ID
Petelin, Nada
(
Author
),
ID
Kitanovski, Andrej
(
Author
)
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MD5: C20DB48E163DAB5B8CACC4FEACD424B5
URL - Source URL, Visit
https://www.sciencedirect.com/science/article/pii/S258900422402488X
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Abstract
In the area of thermal management, thermal control elements (TCEs) and thermal control circuits (TCCs) are proving to be innovative solutions to the challenges of temperature control and heat dissipation in various applications, ranging from electronic cooling to energy conversion and temperature control in buildings. Their integration promises to improve power density, energy efficiency, system reliability and system life expectancy. With the aim of connecting researchers in the field of thermal management and accelerating the development of TCEs and TCCs, we have developed an open-source TCC simulation tool called TCCbuilder that enables a quick and easy time-dependent 1D numerical analysis of the behavior of TCEs and TCCs. It uses the heat conduction equation to solve temperature profiles in different devices. The TCCbuilder application offers features not previously available with any other TCC modelling tool: a large adjacent library of materials and TCEs as well as a user-friendly graphical user interface (GUI).
Language:
English
Keywords:
thermal engineering
,
thermal property
,
materials science
,
thermal switches
,
thermal diodes
,
thermal management
,
heat transfer
,
thermal control devices
Typology:
1.01 - Original Scientific Article
Organization:
FS - Faculty of Mechanical Engineering
Publication status:
Published
Publication version:
Version of Record
Year:
2024
Number of pages:
15 str.
Numbering:
Vol. 27, iss. 12, art. 111263
PID:
20.500.12556/RUL-166914
UDC:
536
ISSN on article:
2589-0042
DOI:
10.1016/j.isci.2024.111263
COBISS.SI-ID:
213537795
Publication date in RUL:
30.01.2025
Views:
1213
Downloads:
888
Metadata:
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Record is a part of a journal
Title:
iScience
Publisher:
Cell Press, Elsevier
ISSN:
2589-0042
COBISS.SI-ID:
24098568
Licences
License:
CC BY 4.0, Creative Commons Attribution 4.0 International
Link:
http://creativecommons.org/licenses/by/4.0/
Description:
This is the standard Creative Commons license that gives others maximum freedom to do what they want with the work as long as they credit the author.
Secondary language
Language:
Slovenian
Keywords:
toplotna stikala
,
toplotne diode
,
toplotni regulatorji
,
prenos toplote
,
upravljanje s toploto
Projects
Funder:
ARIS - Slovenian Research and Innovation Agency
Project number:
J7-3148
Name:
TCCbuilder: Odprtokodno simulacijsko orodje za toplotne tokokroge
Funder:
ARIS - Slovenian Research and Innovation Agency
Project number:
P2-0223
Name:
Prenos toplote in snovi
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