The thesis is about how temperature variations affect the performance of a charge configuration memory (CCM) element. It involves a numerical analysis and quantification of thermally induced deformation and internal stress in CCM elements, monitoring the change in resistance and the occurrence of deformations as a function of ambient temperature and input voltage. Using the finite element method in the COMSOL software, it aims to gain insight into the behavior of these elements under various temperature conditions and to assess the potential impact of deformations on their electrical properties. The results of the study can significantly contribute to a better understanding and optimization of CCM elements for use in cryogenic electronic systems.
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