Razvoj aplikacije za izračun zanesljivosti elektronskih vezij

Kerševan, Jan (author), Sešek, Aleksander (mentor)

Diplomsko delo obravnava razvoj aplikacije, ki na podlagi vhodnih parametrov izračuna predvideno življenjsko dobo elektronskega vezja. Aplikacija omogoča izračun odpovedi v času (FIT), povprečni čas med zaporednimi odpovedmi (MTBF) ter verjetnost odpovedi v določenem časovnem okviru (angl. Chance of Failure) za vsako posamezno komponento, kot tudi za celotno vezje. Komponente, ki so vključene v aplikacijo so kondenzatorji, diode, tranzistorji, upori, integrirana vezja ter tuljave. Matematični model, ki ga aplikacija uporablja za izračun je razvit iz standarda mednarodne elektrotehniške komisije IEC 61709, Električne komponente - Zanesljivost – Referenčni pogoji za pogostost odpovedi in modeli stresa za pretvorbo. Metoda, po kateri je razvit model za računanje zanesljivosti se imenuje ``stres metoda'' (angl. Part stress method).

• Language: Slovenian
• Keywords: zanesljivost, aplikacija, IEC 61709, FIT, MTBF, pogostost odpovedi
• Work type: Bachelor thesis/paper
• Organization: FE - Faculty of Electrical Engineering
• Year: 2022
• PID: 20.500.12556/RUL-138478
• COBISS.SI-ID: 117060355
• Publication date in RUL: 22.07.2022

Secondary language

• Language: English
• Title: Application development for electronic circuits reliability

Abstract

The thesis addresses the development of an application, that computes the predicted lifetime of electronic circuits based on selected input parameters. The application is capable of computing circuit's Failure in Time (FIT) values, as well as Mean Time Between Failures (MTBF) and Chance of Failure for user-selected timeframe. Calculations can be done for a single electronic component or an entire circuit. Components, that are included in the application are capacitors, diodes, transistors, resistors, integrated circuits and inductors. Mathematical model for calculation of above mentioned parameters was developed using the IEC 61709 standard - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion. The method used for calculation of failure rates is called the part stress method.

• Keywords: reliability, application, IEC 61709, FIT, MTBF, failure rate