The buffer effect of different wood species and the influence of oak on panel composites binders
ID Policardi, Franco (Author), ID Thebault, Marion (Author)

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The buffer action of certain wood species can intensely affect the curing and hardening of some thermosetting wood adhesives. The present article presents a quantification of such buffering effects, determined under controlled conditions, in various wood species. The buffer capacity of oak has been found to be rather extreme and is likely to affect quite heavily the ability of urea-formaldehyde (UF) and melamine-urea-formaldehyde (MUF) wood panel adhesives in industrial operations. A variation of the buffer capacity of furnishes containing between 0% and 30% oak chips has been investigated. This was correlated with the internal bond (IB) strength of MUF bonded laboratory particleboards. The wood mixture buffering capacity increases with the oak content, while the panel IB strength decreases.

Keywords:wood buffer capacity, oak wood, wood panel composites, melamine-urea-formaldehyde, urea-formaldehyde, wood adhesives
Work type:Article (dk_c)
Typology:1.01 - Original Scientific Article
Organization:FE - Faculty of Electrical Engineering
Publication status in journal:Published
Article version:Publisher's version of article
Number of pages:9 str.
Numbering:Vol. 12, iss, 7, art. 1540
ISSN on article:2073-4360
DOI:10.3390/polym12071540 This link opens in a new window
COBISS.SI-ID:23399683 This link opens in a new window
Publication date in RUL:17.12.2021
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Record is a part of a journal

Shortened title:Polymers
Publisher:Molecular Diversity Preservation International
COBISS.SI-ID:517951257 This link opens in a new window


License:CC BY 4.0, Creative Commons Attribution 4.0 International
Description:This is the standard Creative Commons license that gives others maximum freedom to do what they want with the work as long as they credit the author.
Licensing start date:12.07.2020

Secondary language

Keywords:zmogljivost blažilnika lesa, hrastov les, kompoziti iz lesenih plošč, melamine-urea-formaldehid, urea-formaldehid, lepila za les

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