The buffer action of certain wood species can intensely affect the curing and hardening of some thermosetting wood adhesives. The present article presents a quantification of such buffering effects, determined under controlled conditions, in various wood species. The buffer capacity of oak has been found to be rather extreme and is likely to affect quite heavily the ability of urea-formaldehyde (UF) and melamine-urea-formaldehyde (MUF) wood panel adhesives in industrial operations. A variation of the buffer capacity of furnishes containing between 0% and 30% oak chips has been investigated. This was correlated with the internal bond (IB) strength of MUF bonded laboratory particleboards. The wood mixture buffering capacity increases with the oak content, while the panel IB strength decreases.
| Language: | English |
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| Keywords: | wood buffer capacity, oak wood, wood panel composites, melamine-urea-formaldehyde, urea-formaldehyde, wood adhesives |
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| Work type: | Article (dk_c) |
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| Typology: | 1.01 - Original Scientific Article |
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| Organization: | FE - Faculty of Electrical Engineering
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| Year: | 2020 |
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| Publication status in journal: | Published |
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| Article version: | Publisher's version of article |
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| Number of pages: | 9 str. |
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| Numbering: | Vol. 12, iss, 7, art. 1540 |
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| UDC: | 62:630*8 |
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| ISSN on article: | 2073-4360 |
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| DOI: | 10.3390/polym12071540  |
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| COBISS.SI-ID: | 23399683 |
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| Publication date in RUL: | 17.12.2021 |
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| Views: | 135 |
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| Downloads: | 46 |
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