For many years the primary process for joining electrical copper contacts was soldering. Soldering gives great results in terms of joint conductivity, but is slow, inefficient, and problematic to automate. Due to the need of lowering costs and cycle time an alternative in welding TIG was found. A significant amount of costs of welding TIG is the shielding gas. We analysed an option of implementing nitrogen gas in the process and its influence on the process output. We compared results with regularly used shielding gases, such as argon and helium. We evaluated results visually and numerically with stress test and microstructure analysis. The conclusion was that with using nitrogen as a shielding gas no process requirement other than visual can be achieved. We confirmed the thesis that with using helium or argon as shielding gas requirements can be achieved. We also conducted a cost analysis which confirmed the current shielding gas choice, that is argon, as correct to continue manufacturing the product.
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