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Prototipni miniaturni hladilni sistem
Hvala, Klemen (Author), Kitanovski, Andrej (Mentor) More about this mentor... This link opens in a new window

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Abstract
Z miniaturizacijo elektronskih vezij ter povečevanjem njihove zmogljivsti se povečuje potreba po odvodu odpadne toplote. V prihodnosti trenutne tehnologije zračnega ter vodnega hlajenja tem potreban ne bodo več zmožne slediti. Poiskati moramo nove rešitve, ki bodo za hlajenje izkoriščale latentno toploto. V okviru te naloge je bila opravljena eksperimentalna in teoretična analiza dveh miniaturnih hladilnih sistemov. Prvega na osnovi parno-kompresijskega in drugega na osnovi črpalno-uparjalnega hlajenja. Eksperimentalni rezultati so pokazali, da je slednji v primerjavi z vodnim hlajenjem sposoben odvajati 3-krat večjo količino toplote na osnovi enakega masnega toka.

Language:Slovenian
Keywords:hlajenje elektronike, prenos toplote, vodno hlajenje, parno-kompresijsko hlajenje, črpalno-uparjalno hlajenje, uparjanje
Work type:Master's thesis/paper (mb22)
Tipology:2.09 - Master's Thesis
Organization:FS - Faculty of Mechanical Engineering
Year:2021
Publisher:[K. Hvala]
Number of pages:XXIV, 76 str.
UDC:621.56:536.2(043.2)
COBISS.SI-ID:63173635 This link opens in a new window
Views:120
Downloads:0
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Secondary language

Language:English
Title:Prototype of a miniature refrigeration system
Abstract:
With the miniaturization of electronic circuits and increase in their performance, the need for waste heat dissipation is increasing. In the future, the current air and water cooling technologies will no longer be able to keep up. We need to find new solutions that will use latent heat. As part of this task, an experimental and theoretical analysis of two miniature cooling systems was performed. The first on the basis of steam-compression and the second on the basis of pumped-evaporative cooling. Experimental results have shown that the latter is able to dissipate 3 times the amount of heat based on the same mass flow compared to water cooling.

Keywords:cooling electronics, heat transfer, water cooling, steam-compression cooling, pumped two phase cooling, evaporation

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