Mehanske obremenitve tiskanih vezij med procesom proizvodnje

Kastelic, Tomaž (author), Slavič, Janko (mentor), Boltežar, Miha (comentor)

Tiskana vezja so sestavni del linearnih in rotacijskih agnetnih enkoderjev, ki jih proizvajajo v podjetju RLS Merilna tehnika d.o.o.. Med procesom izdelave so tiskanine obremenjene z različnimi mehanskimi in temperaturnimi obremenitvami, ki lahko privedejo do poškodb na tiskanini in lotanih spojih. V okviru magistrskega dela smo z metodo končnih elementov izvedli numerične simulacije obremenitev na tiskanem vezju. Obravnavali smo tri faze proizvodnega procesa: spajkanje komponent, programiranje procesorja in depanelizacijo. Za validacijo teh simulacij smo pred tem izvedli tudi validacijski eksperiment ter postavili numerični model. Simulacije so bile izvedene v programu Comsol. Ugotovili smo, da med procesom izdelave na tiskanih vezjih ne nastajajo kritične deformacije.

• Language: Slovenian
• Keywords: tiskanine, proces proizvodnje, mehanske obremenitve, temperaturne obremenitve, deformacije, metoda končnih elementov, Comsol
• Work type: Master's thesis/paper
• Typology: 2.09 - Master's Thesis
• Organization: FS - Faculty of Mechanical Engineering
• Place of publishing: Ljubljana
• Publisher: [T. Kastelic]
• Year: 2019
• Number of pages: XXV, 92 str.
• PID: 20.500.12556/RUL-107848
• UDC: 621.3.049.75:519.61(043.2)
• COBISS.SI-ID: 16659483
• Publication date in RUL: 31.05.2019

KASTELIC, Tomaž, 2019, Mehanske obremenitve tiskanih vezij med procesom proizvodnje [online]. Master’s thesis. Ljubljana : T. Kastelic. [Accessed 31 March 2025]. Retrieved from: https://repozitorij.uni-lj.si/IzpisGradiva.php?lang=eng&id=107848

Secondary language

• Language: English
• Title: Mechanical loads on printed circuit boards during the manufacturing process

Abstract

Printed circuit boards (PCBs) are an integral part of linear and rotary magnetic encoders, which are produced by RLS Merilna tehnika d.o.o. company. Mechanical and thermal loads are applied to PCBs during the production process and this can lead to failures in a PCB and solder joints. For this master’s dissertation numerical simulations of the loads on a PCB were carried out using the finite element method. Three different load cases were considered: reflow soldering, processor programming and depaneling. To validate the simulations first a validation experiment was conducted. A numerical model was built in Comsol modeling software. The numerical simulations have shown that no critical strain occurs on PCBs during the production process.

• Keywords: printed circuit boards (PCBs), manufacturing process, mechanical loads, thermal loads, strains, finite element method, Comsol