Evalvacija programskega paketa HyperLynx 3D EM za določanje parametrov linij na tiskanih vezjih

BALENT, JOŠT (author), Jankovec, Marko (mentor)

Diplomsko delo se ukvarja s 3D simulacijo visokofrekvenčnih povezav na tiskanih vezjih. Namen dela je pridobiti strnjen RLC model vezja na podlagi 3D elektro-magnetne simulacije ter ga validirati s pomočjo meritev na vektorskem analizatorju vezij ter na podlagi rezultatov oceniti uporabnost programskega paketa in metode. Validiran model RLC bi se uporabljal v SPICE 3 simulacijah. Eden od rezultatov simulacije so parametri S, ki jih lahko preračunamo v strnjen RLC model, ki smo ga vnesli nazaj v simulator ter primerjali prvotne parametre S s parametri S strnjenega nodela RLC. Nastavitve natančnosti smo spreminjali dokler ni bila stopnja ujemanja dovolj dobra. Nato smo v simulator vnesli parametre resnične mikrotrakaste linije ter izračunane parametre S primerjali z izmerjenimi. Rezultati so pokazali, da je stopnja ujemanja med simulacijo na podlagi tako dobljenega strnjenega RLC modela ter meritvami dovolj dobra za ožji frekvenčni pas. Sam programski paket se je na osnovi preproste mikrotrakaste linije izkazal za dovolj dobrega, vendar pa se je pri simulaciji kompliciranih struktur izkazalo, da je poln hroščev in se ga ne da priporočiti za uporabo v industrijskem okolju.

• Language: Slovenian
• Keywords: 3D elektro-magnetna simulacija, visokofrekvenčna vezja, tiskana vezja, mikrotrakasta linija, linija, strnjen RLC model, HyperLynx 3D
• Work type: Undergraduate thesis
• Organization: FE - Faculty of Electrical Engineering
• Year: 2016
• PID: 20.500.12556/RUL-84704
• Publication date in RUL: 31.08.2016

Secondary language

• Language: English
• Title: Evaluation of the Hyperlinx 3D EM software to determine the parameters of transmission lines on printed circuit boards

Abstract

The thesis addresses 3D Electro-magnetic simulation of high-frequency connections on printed circuit boards. The goal is to acquire a lumped RLC model of the PCB and to validate it by measurement on a vector network analyser so the program package and the method can be evaluated. The validated RLC model derived from this method would be used in further analysis in SPICE 3 simulations. The built-in algorithms transform the resulting S-parameters of the simulation to a lumped RLC model. The RLC model was re-simulated and its S-parameters compared with the results from the 3D Electro-Magnetic simulation. The simulation settings were tweaked until the match was good. A real life microstrip parameters were input and its simulation results were compared with the measurements. According to the results, the method can be used for a moderate frequency bandwidth. The program package itself proved to be useful only for the simplest structures, like microstrips and microlines, due to many unresolved bugs which made the simulation of complicated structures impossible to complete. The program package, as is, is not suitable for use in production environments and it can’t be recommended.

• Keywords: 3D Electro-magnetic simulation, high-frequency circuits, Printed circuit boards, microstrip, microline, lumped RLC model, HyperLynx 3D EM