The fireproof structural insulation panel system was made from spruce chips pre-impregnated with an water solution of Burnblock (BB) and glued with phenol formaldehyde glue in powder form. Although this glue is not primarily used for chipboards, we used this type of glue because of its good waterproof properties, and in powder form because we already applied Burnblock to the chips to provide additional moisture for the reaction with the glue. In order to determine the best properties and composition of the final version of the board, we previously produced several different boards with different impregnation times of chips with BB, with chips of different sizes and with combinations of several different fractions of chips. We then made the final version of the structural insulation panel system (SIP) in three layers. We made them in one phase and in two phases. We found that the mechanical and fire-resistant properties of the outer layer of SIP are best with a combination of small and large chips in a ratio of 3:1, and the insulation of the SIP core was ensured by using large particles for its production. We found that our SIP has sufficiently good mechanical properties and, as far as fire resistance is concerned, is significantly better than the reference board.
|
