The increasing density of heat dissipated in a small area by electronic components and devices poses an ever-greater challenge for ensuring adequate cooling. In the field of electronics cooling, air and liquid cooling systems dominate the market, while researchers have recently been looking into the use of vapor compression systems. In this master thesis, we analyzed the performance of a micro vapor compression system that could be used for cooling electronics. Using a parametric analysis, we investigated the performance of the system with different charges of the refrigerant R600a, which was chosen for its low global warming potential (GWP) and ozone depletion potential (ODP). Each refrigerant charge was tested at three different cooling capacities and eleven different compressor rotations. The results showed a maximum cooling capacity of 376 W with a charge of 150 g refrigerant, compressor running at 6500 rpm and evaporation and condensation temperatures of 14,1 and 44,1 °C, respectively. With the same charge, compressor at 3000 rpm and evaporation and condensation temperatures of 19,6 and 38,7 °C respectively, the system achieved the highest coefficient of performance (COP) of 8.9. Our results show that a micro vapor compression system can also be used for smaller cooling capacities. However, specific operating conditions and properties of the refrigerant used must be taken into account for optimum system performance.
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