In this master's thesis, we focused on the issue of cooling small components in electronic devices, where proper heat dissipation is crucial for optimal performance. We developed a measurement setup to assess the impact of an impinging jet on heat dissipation at the surface. The results showed a good agreement with the mathematical correlation describing the heat flux from the surface. This finding contributes to a better understanding of cooling processes and can serve as a basis for further improvements in the cooling of electronic components.
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