Vpeljava tehnologije za točno polaganje LED komponent v SMT procesu

LAZAR, MIHA (author), Begeš, Gaber (mentor)

V tej magistrski nalogi je opisan pristop k reševanju izziva točnega pozicioniranja LED diode v tolerančnih mejah ± 100 μm pri kratkoročni zmogljivosti procesa 1,66. Doseganje tako ozkih toleranc polaganja LED komponent je mogoče z vpeljavo novih procesnih korakov lepljenja, z optično preverbo središča svetilne površine LED komponente in s polaganjem komponente z izračunanim zamikom. Teoretični del predstavi osnove SMT (ang. surface mounted technology) proizvodnje, teoretične prispevke negotovosti, opis tehnološkega procesa za točno polaganje LED komponent in predstavitev metod ter orodij kakovosti. V praktičnem delu je po korakih opisan šest sigma pristop DMAIC metode. Reševalo se je realni izziv v proizvodnji - oženje procesnega raztrosa pri polaganju LED komponent v SMT procesu. K izzivu se je pristopilo sistematično. Po korakih se je pridobivalo novo znanje in izboljševalo proizvodni proces s pomočjo orodij kakovosti. V magistrski nalogi sta popisana dva DMAIC pristopa na praktičnem primeru. Za optimizacijo novega lepilnega procesa v podjetju se je uporabil pristop izdelave statističnega modela procesa s pomočjo DOE eksperimenta. Pristop se je izkazal kot pravilen saj se je z majhnim številom ponovitev pridobilo uporaben model za nastavljanje željene oblike lepilne kaplje. Za doseganje manjše pozicijske negotovosti središča LED svetilnega območja se je k problemu stopilo s krogi izboljšav. Izvedlo se je 6 krogov izboljšav. Med izvajanjem krogov izboljšav se je pridobilo pomembna znanja o uporabi naprav, načrtovanja referenčnih sistemov in vplivu toleranc vhodnih materialov. Kot rezultat zbranega znanja so nastali Ishikawa diagrami in procesni diagrami, ki ponujajo veliko vrednost v primeru nadaljnje uporabe procesne tehnologije na novih projektih. Izid optimizacije in krogov izboljšav je bil stabilen lepilni proces in doseganje toleranc pri procesu polaganja središča LED svetilnega območja znotraj toleranc ± 100 μm s kratkoročno procesno zmogljivostjo Cmk: 2,19 in standardno deviacijo ±19 μm.

• Language: Slovenian
• Keywords: SMT, DOE, DMAIC, študija zmogljivosti procesa, polaganje LED komponent, šest sigma
• Work type: Master's thesis/paper
• Organization: FE - Faculty of Electrical Engineering
• Year: 2023
• PID: 20.500.12556/RUL-153146
• ISSN: 181913603
• COBISS.SI-ID: 181913603
• Publication date in RUL: 19.12.2023

Secondary language

• Language: English
• Title: Technology of accurate placement of LED components introduction in the SMT process

Abstract

In this master's thesis is described an approach to solving the challenge of precise positioning of LED diodes within tolerance limits of ± 100 μm with a short-term process capability of 1.66. Achieving such narrow tolerances of placing LED components is possible by introducing new process steps such as gluing, optical verification of the center of the LED component illuminating surface and placing the component with a calculated offset. The theoretical part introduces the basics of SMT (surface mounted technology) production, theoretical contributions to uncertainty, a description of the technological process for precise placement of LED components, and presentation of quality methods and quality tools. In the practical part, the Six Sigma DMAIC method approach is described step by step. A real production challenge of narrowing the process spread in placing LED components in the SMT process was addressed. The approach to the challenge was systematic. New knowledge was gained step by step, and the production process was improved with the help of quality tools. Two DMAIC approaches are described in the master's thesis based on practical examples. For optimizing a new adhesive process in the company, an approach involving the creation of a statistical process model using a Design of Experiments (DOE) experiment was used. The approach proved to be correct, as a useful model for adjusting the desired shape of the adhesive drop was obtained with a small number of repetitions. To achieve a smaller positional uncertainty of the center of the LED illuminating area, the problem was addressed with circles of improvement. Six rounds of improvements were carried out. Important knowledge about the use of devices, design of reference systems, and the influence of tolerances of input materials was gained during the implementation of improvement cycles. As a result of the collected knowledge, Ishikawa diagrams and process diagrams were created, offering significant value in the case of further use of process technology in new projects. The outcome of optimization and improvement cycles was a stable adhesive process and achieving tolerances in the process of placing the center of the LED illuminating area within tolerances of ± 100 μm with a short-term process capability Cmk: 2.12 and a standard deviation of ±19 μm.

• Keywords: SMT, DOE, DMAIC, process capability study, precise placement of LED components, Six Sigma