The thesis presents the production process of assembling a circuit board. Circuit boards are nowadays found in almost every electrical device. They determine how a certain device will operate.
The main focus of the thesis is on the SMT section. In this part we present everything about the development of the program for solder paste printing on PCB, the structure of the solder paste, optical overview of paste deposit and the main part, assembling components on the PCB. We can say, that the main production process is reflowing of the solder paste or soldering SMT components. That is why we have focused mostly on this topic. Special attention needs to be devoted on the PCB joints, in order to find any production faults which need to be resolved before the board moves to further processing. This work is controlled by the AOI operator. The majority of the PCBs are composed with THT components, which are needed for proper functioning of the board. Soldering of the components is carried either manually or using a selective soldering technique. When the PCB is manufactured, final check and cleaning is performed before dispatching. At this point, the PCB is properly packed, in order to avoid any damage during the transport.