20.500.12556/RUL-95093 Konstruiranje večplastnega tiskanega vezja in namenskega ohišja elektronske naprave ACTIVE PROBE INFINEON DAP Design of multilayer PCB and custom enclosure for the ACTIVE PROBE INFINEON DAP device V diplomskem delu je kronološko razdelan razvoj strojnega dela produkta ACTIVE PROBE INFINEON DAP, ki je last podjetja iSYSTEM Labs d.o.o. Elektronska naprava omogoča enostavnejše in naprednejše programiranje, razhroščevanje in sledenje programski kodi mikrokrmilnikov podjetja Infineon, do katerih dostopamo prek DAP priključka. Naprava, zaradi svoje majhnosti, omogoča enostavnejši priklop testnega sistema v najrazličnejših aplikacijah in situacijah. Razvoj strojnega dela projekta se je pričel s snovanjem električne sheme in njenega blokovnega diagrama, nato je sledila določitev oblike vezja in izbira ohišja. Po zaključenem konstruiranju osem plastnega tiskanega vezja je bilo potrebno vezje sestaviti, programirati in testirati. Opisani sta meritvi porabe električne moči vezja ter temperature ohišja. Načrtovanje tiskanega vezja je bilo izvedeno v programskem okolju OrCAD podjetja Cadence, ohišje in ostali mehanski sklopi pa so bili konstruirani s programskim paketom SolidWorks. Za pripravo informacijske nalepke produkta, tiska ohišja in dokumentacijskega gradiva je bil uporabljen program CorelDraw. In the diploma I chronologicly elaborate the development of the hardware part of the product ACTIVE PROBE INFINEON DAP, which is the property of iSYSTEM Labs d.o.o.. The electronic device enables simpler and more advanced programming, debugging and tracing the Infineon microcontrollers' firmware that we access through the DAP connector. Due to its small size, the device makes it easier to connect the target system in a wide variety of applications and situations. The development of the hardware part of the project began with the design of the electrical schematic and its block diagram, followed by the determination of the shape of the circuit and the choice of the enclosure. After the completion of the construction of the eight layered printed circuit board, the circuit had to be assembled, programmed and tested. The measurement of the power consumption of the circuit and the temperature of the enclosure are also described. The design of the printed circuit board was carried out in the OrCAD software by Cadence, the enclosure and other mechanical parts were designed with the SolidWorks software package. The CorelDraw program was used to prepare the information label of the product, the enclosure's graphics and the documentation. večplastno tiskano vezje ohišje OrCAD SolidWorks CorelDraw multilayer printed circuit board enclosure OrCAD SolidWorks CorelDraw true false false Slovenski jezik Angleški jezik Diplomsko delo/naloga 2017-09-14 11:54:46 2017-09-14 11:54:47 2022-08-10 02:16:07 0000-00-00 00:00:00 2017 0 0 0000-00-00 NiDoloceno NiDoloceno NiDoloceno 0000-00-00 0000-00-00 0000-00-00 1970-01-01 39581 Titoric_Aljaz_-_Konstruiranje_vecplastnega_tiskanega_vezja_in_namenskega_ohisja_elektronske_napr.pdf Titoric_Aljaz_-_Konstruiranje_vecplastnega_tiskanega_vezja_in_namenskega_ohisja_elektronske_napr.pdf 1 6E17BB4386C4B1BB4F9B6528432B545D 66da7ac0a5770d82ad5e117edfc39b06d85bf6094d0b68ef1c521cf88e4fe837 acd4a05c-a1b3-11eb-a523-00155dcfd717 20.500.12556/rul/24ba7b95-9eac-4280-8e57-dfbceb299601 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=103620 Fakulteta za elektrotehniko 0 0 0