20.500.12556/RUL-151947 Vplivi hladilnega bloka na deformacije in napetosti v tiskanem vezju Effects of a cooling block on strains and stresses in a printed circuit board Cilj magistrskega dela je eksperimentalna določitev napetosti in deformacij, ki nastanejo ob namestitvi hladilnega bloka na tiskano vezje, in identificirati, kateri način vpetja je najprimernejši glede na velikost glavnih deformacij in napetosti. Na izbrano tiskano vezje smo namestili merilne rozete za merjenje deformacij. Rozete smo povezali v merilno napravo, ki je signal ojačala in ga pretvorila v digitalno obliko, nato pa smo izmerke spremljali s pomočjo programske opreme na osebnem računalniku. Določili smo moment privitja vijakov in izvedli različne načine vpetja hladilnega bloka na tiskano vezje. Za vsako vpetje smo naredili tri meritve. Iz rezultatov sklepamo, da je najugodnejše vpetje z uporabo vzmetne oporne plošče, ker najugodneje vpliva na deformacijsko in napetostno stanje v izbranem tiskanem vezju. V določenih primerih, kjer je kakovost primerjalne analize omejena zaradi relativno velikega raztrosa merilnih rezultatov, bi bilo v prihodnje smiselno opraviti več meritev v bolj nadzorovanih pogojih. The aim of the MSc thesis is to experimentally determine the stresses and strains generated when a cooling block is mounted on a printed circuit board and to identify which mounting method is the most appropriate in terms of the magnitude of the main strains and stresses. Strain gauge rosettes were mounted on the selected PCB. The rosettes were connected to a measuring device which amplified the signal and converted it into digital form, and the measurements were then monitored using software on a PC. The tightening moment of the screws was determined and different ways of clamping the cooling block to the PCB were implemented. Three measurements were taken for each fixture. From the results, we conclude that the clamping using the spring retaining plate is the most advantageous, because it has the most favourable effect on the deformation and stress state in the selected PCB. In certain cases where the quality of the comparative analysis is limited due to the relatively large scatter of measurement results, it would be reasonable to perform more measurements in the future, under more controlled conditions. tiskano vezje hladilni blok napetosti deformacije merilni lističi printed circuit board cooling block stresses strains strain gauges true false false [V. Škrlj] Slovenski jezik Angleški jezik Magistrsko delo/naloga 2023-10-26 08:30:24 2023-10-26 08:30:26 2023-11-15 10:24:49 0000-00-00 00:00:00 2023 0 Ljubljana 0 XX, 71 str. 0000-00-00 NiDoloceno NiDoloceno NiDoloceno 0000-00-00 0000-00-00 0000-00-00 66.045.53:531.222(043.2) 257786 172217859 32413.pdf 32413.pdf 1 61376F56503A30557D8CC7AE98A111CE 1999f36759ca5caeae097b621b4c884ba3fff2e5d2f5a464d18b8266971cbfe1 27da1540-73c9-11ee-a653-0050569b8976 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=177107 Fakulteta za strojništvo 0 0 0