20.500.12556/RUL-149168 Inkapsulacija elektronskih komponent v polimerno maso Encapsulation of electronic components in polymer resin Magistrska naloga obravnava problem vgrajevanja elektronskih komponent v ohišje. Zajema pregled literature, kateri sledi zasnova konceptov. Z analitično hierarhičnim procesom se ovrednoti koncepte in izdelovalne tehnologije. Z numeričnimi simulacijami se preveri konstrukcijske rešitve in optimizira tehnologijo najbolje ocenjenega koncepta. Ključne mehanske parametre materiala ohišja se določi eksperimentalno. Ugotovili smo, da je za dano aplikacijo najbolj primerna tehnologija inkapsulacije - poting. Prav tako z izbiro konstrukcije močno vplivamo na napetosti, ki se pojavljajo na vezju. Ugotovili smo, da s spreminjanjem temperature strjevanja vplivamo na mehanske lastnosti materiala in posledično na napetosti v polimerno-elektronskem sestavu. The master thesis covers the issue of integrating electronic components into the housing, including a literature overview followed by concept design. With anlytic hierarchy process, we evaluate concepts and manufacturing technologies. Additionally, with numerical simulation, we can asses design solutions and optimizes the technology of the highest classified concept. Key material mechanical parameters of the housing are experimentally tested. It was discovered that for the provided application, the most appropriate technology is incapsulation potting. Moreover, with the construction selection, we can massively affect the tension on the PCB. To conclude, we discovered that with changing temperature curing, we could impact the mechanical properties of the material and consequently impact the tension into a polymer-electronic assembly. inkapsulacija metoda AHP poting prebrizgavanje numerična simulacija polimerni materiali encapsulation AHP analysis potting overmolding numerical simulation polymer materials true false false [N. Pavlin] Slovenski jezik Angleški jezik Magistrsko delo/naloga 2023-09-05 08:30:55 2023-09-05 08:30:56 2023-09-28 09:58:12 0000-00-00 00:00:00 2023 0 Ljubljana 0 XXII, 83 str. 0000-00-00 NiDoloceno NiDoloceno NiDoloceno 0000-00-00 0000-00-00 0000-00-00 004.942:519.876.5:621.38(043.2) 255800 166142211 29640.pdf 29640.pdf 1 9ECA8DF74CBDC3C38D9822E869A2E3E4 569192835510395a508eb579b3a344e3f4febdc827ada80c7f3ddf36b2dcd430 c24f0c09-4bb5-11ee-af86-0050569b8976 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=173566 Fakulteta za strojništvo 0 0 0