20.500.12556/RUL-103534 Proizvodni proces opremljanja tiskanega vezja Production process of PCB manufacturing Namen diplomske naloge je predstaviti proizvodni proces opremljanja tiskanega vezja. Tiskana vezja danes srečujemo pravzaprav že v čisto vseh elektronskih napravah. Od njih je odvisno, kako bo naprava delovala. Osredotočili smo se na del strojnega polaganja komponent, imenovan SMT oddelek. V tem delu bo predstavljena izdelava programa za tiskanje spajkalne paste na PCB (Printed Board Circuit), sestava spajkalne paste, optični pregled nanosa paste in glavni del polaganja komponent na tiskano vezje. V proizvodnem procesu je bistvenega pomena tudi taljenje spajkalne paste oz. spajkanje SMT komponent, zato smo tudi to tematiko bolj natančno opisali in predstavili. Spoje na tiskanih vezjih je potrebno skrbno pregledati in morebitne napake odpraviti, preden vezje nadaljuje svojo pot po proizvodnji. Za to skrbi AOI (Automated Optical Inspection) operater. Večina tiskanih vezij je sestavljena z uporabo THT (Through Hole Technology) komponent, ki jih potrebujemo za pravilno delovanje tiskanega vezja. Spajkanje teh komponent se opravlja ročno ali z metodo selektivnega spajkanja. Po končani obdelavi tiskanega vezja sledi pregled in čiščenje vezja pred odhodom v odpremo. Na tem mestu se tiskano vezje ustrezno zapakira, da med transportom ne pride do poškodb. The thesis presents the production process of assembling a circuit board. Circuit boards are nowadays found in almost every electrical device. They determine how a certain device will operate. The main focus of the thesis is on the SMT section. In this part we present everything about the development of the program for solder paste printing on PCB, the structure of the solder paste, optical overview of paste deposit and the main part, assembling components on the PCB. We can say, that the main production process is reflowing of the solder paste or soldering SMT components. That is why we have focused mostly on this topic. Special attention needs to be devoted on the PCB joints, in order to find any production faults which need to be resolved before the board moves to further processing. This work is controlled by the AOI operator. The majority of the PCBs are composed with THT components, which are needed for proper functioning of the board. Soldering of the components is carried either manually or using a selective soldering technique. When the PCB is manufactured, final check and cleaning is performed before dispatching. At this point, the PCB is properly packed, in order to avoid any damage during the transport. SMT PCB spajkalna pasta talilna peč THT selektivno spajkanje SMT PCB Solder Paste Reflow Oven THT Selective Soldering true false false Slovenski jezik Angleški jezik Diplomsko delo/naloga 2018-09-19 11:00:04 2018-09-19 11:00:09 2022-08-16 03:42:42 0000-00-00 00:00:00 2018 0 0 0000-00-00 NiDoloceno NiDoloceno NiDoloceno 0000-00-00 0000-00-00 0000-00-00 1970-01-01 43582 Hrestak_Zan_-_Proizvodni_proces_opremljanja_tiskanega_vezja.pdf Hrestak_Zan_-_Proizvodni_proces_opremljanja_tiskanega_vezja.pdf 1 E4DC73290DC562F70E2A50364B87710A b1eb698f681edb3a3446e23e684ddc1a021a356fd378f409606e97cae57df360 d55a1272-a1b5-11eb-a523-00155dcfd717 https://repozitorij.uni-lj.si/Dokument.php?lang=slv&id=113974 Fakulteta za elektrotehniko 0 0 0