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<metadata xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/"><dc:title>Towards a miniaturized microstrip attenuator with the composite material film</dc:title><dc:creator>El Bouslemti,	Rahmouna	(Avtor)
	</dc:creator><dc:creator>Fraha,	C. Mahdi	(Avtor)
	</dc:creator><dc:creator>Amrane,	I. Meryeme	(Avtor)
	</dc:creator><dc:creator>Herir,	H.	(Avtor)
	</dc:creator><dc:subject>microstrip</dc:subject><dc:subject>microwave attenuator</dc:subject><dc:subject>Graphite/SiC</dc:subject><dc:subject>S-parameters</dc:subject><dc:subject>HFSS simulation</dc:subject><dc:description>In this study, A microstrip attenuator made of a graphite, silicon carbide (SiC), graphite and silicon carbide (GSC) thin film is designed, fabricated, and tested. The attenuator was tested in the frequency found from 1 to 10 GHz using the PCB technology and implemented on an FR4 substrate. Using the HFSS software and based on experimental results, the attenuation characteristics and performance of various materials are investigated. The HFSS simulations considered the key parameters, such as the material conductivity, dielectric constant, film thickness, and examined their impact on the electromagnetic field distribution,. A considerable attenuation is observed in these materials, albeit with variations across the tested frequencies. The paper highlights the potential of the composite materials, sach as GSC, in advancing the attenuator technology, particularly for applications requiring compact, efficient, and broadband solutions. It is shown that integrating composite films into microstrip attenuators significantly improves their performance. The final results, corroborated by both simulations and practical experiments, confirm that these materials are viable for the RF and microwave applications.</dc:description><dc:date>2025</dc:date><dc:date>2026-06-15 14:20:57</dc:date><dc:type>Članek v reviji</dc:type><dc:identifier>183582</dc:identifier><dc:identifier>UDK: 621.317.7:621.372.2</dc:identifier><dc:identifier>ISSN pri članku: 0013-5852</dc:identifier><dc:identifier>COBISS_ID: 280548611</dc:identifier><dc:language>sl</dc:language></metadata>
