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<metadata xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/"><dc:title>Improving light outcoupling and addressing measurement specifics in perovskite light-emitting diodes with light management foils</dc:title><dc:creator>Kovačič,	Milan	(Avtor)
	</dc:creator><dc:creator>Jošt,	Marko	(Avtor)
	</dc:creator><dc:creator>Krč,	Janez	(Avtor)
	</dc:creator><dc:creator>Topič,	Marko	(Avtor)
	</dc:creator><dc:description>Near-infrared perovskite light-emitting diodes (PeLEDs), with four perovskite(PK) layer thicknesses and optional micro-textured light management (LM) foil,are fabricated to evaluate their effects on light outcoupling efﬁciency. Deviceswith a 70 nm thick PK exhibit highest external quantum efﬁciencies (EQE),compared to those with thinner or thicker PK layers. The PK thickness inﬂuencesthe overall thin-ﬁlm stack and, consequently, the light outcoupling. LM foilssigniﬁcantly improve light outcoupling across all devices, with the thickest PKlayer (160 nm) beneﬁting the most (60% increase), while the thinnest (40 nm)sees the least improvement (30%). Measured trends align well with opticalmodeling results, further highlighting the impact of sample holder design andpixel position on results. Theoretical optimization of PK thickness indicatesunique optimal values for devices with or without LM foils. For devices incor-porating LM foils, simulations predict an optimal PK thickness of 80 nm and anEQE of 27%. In contrast, for devices without LM foils, the optimal PK thickness of60 nm corresponds to simulated EQE of 17%. In all cases, LM foils signiﬁcantlyenhance light outcoupling from bottom-emitting PeLEDs while emphasizing thenecessity to include LM foils in the thin-ﬁlm layer stack optimization process.</dc:description><dc:date>2025</dc:date><dc:date>2025-08-19 10:45:16</dc:date><dc:type>Članek v reviji</dc:type><dc:identifier>171204</dc:identifier><dc:identifier>UDK: 621.383.51:549.641</dc:identifier><dc:identifier>ISSN pri članku: 2699-9293</dc:identifier><dc:identifier>DOI: 10.1002/adpr.202400188</dc:identifier><dc:identifier>COBISS_ID: 233035267</dc:identifier><dc:language>sl</dc:language></metadata>
