Passive thermal management of electronic devices using sorption-based evaporative coolingLiu, Haoran (Avtor) Yu, Jiaqi (Avtor) Wang, Chenxi (Avtor) Zeng, Ziya (Avtor) Poredoš, Primož (Avtor) Wang, Ruzhu (Avtor) evaporative coolingsorption materialsnanocomposite hygroscopic materialsCFD simulationsthermal managementelectronic devices20232024-02-20 10:01:58Članek v reviji154524UDK: 621.56/.59:620.9ISSN pri članku: 2666-9986DOI: 10.1016/j.device.2023.100122COBISS_ID: 186083075sl