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<metadata xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/"><dc:title>Flexible energy-storage ceramic thick-film structures with high flexural fatigue endurance</dc:title><dc:creator>Šadl,	Matej	(Avtor)
	</dc:creator><dc:creator>Lebar,	Andrej	(Avtor)
	</dc:creator><dc:creator>Valentinčič,	Joško	(Avtor)
	</dc:creator><dc:creator>Uršič Nemevšek,	Hana	(Avtor)
	</dc:creator><dc:subject>flexible electronics</dc:subject><dc:subject>ceramic thick films</dc:subject><dc:subject>energy storage</dc:subject><dc:subject>aerosol deposition method</dc:subject><dc:subject>polyimide substrate</dc:subject><dc:subject>relaxor-ferroelectrics</dc:subject><dc:subject>ceramics</dc:subject><dc:subject>deposition</dc:subject><dc:subject>electric fields</dc:subject><dc:subject>granular materials</dc:subject><dc:subject>thin films</dc:subject><dc:description>When developing flexible electronic devices, trade-offs between desired functional properties and sufficient mechanical flexibility must often be considered. The integration of functional ceramics on flexible materials is a major challenge. However, aerosol deposition (AD), a room-temperature deposition method, has gained a reputation for its ability to combine ceramics with polymers previously considered incompatible with the conventional high-temperature sintering process. In this work, 0.9Pb(Mg$_{1/3}$Nb$_{2/3}$)O$_3$−0.1PbTiO$_3$ (PMN−10PT) thick films were deposited directly on a polyimide substrate using the AD method. As a result, dense and flexible relaxor-ferroelectric thick films were produced by a one-step direct-integration, suitable for large-scale production. After annealing of as-deposited PMN−10PT films at 400 °C, stress-relaxation occurs, which is responsible for the development of a relaxor-ferroelectric character. Achieved high polarization (38 μC·cm$^{−2}$), high dielectric breakdown strength (∼1000 kV·cm$^{−1}$), and low hysteresis losses lead to improved recoverable energy density and energy-storage efficiency of the annealed thick films, reaching 10 J·cm$^{−3}$ and 73% (at 1000 kV·cm$^{−1}$), respectively. The thick films were subjected to flexural bending tests, which showed high flexibility (1.1% bending strain) and high durability (10$^5$ bending cycles). This stable energy-storage operation makes ceramic-polymer layered structures promising for integration into a wide range of flexible electronic devices.</dc:description><dc:date>2022</dc:date><dc:date>2022-09-16 13:05:31</dc:date><dc:type>Članek v reviji</dc:type><dc:identifier>140633</dc:identifier><dc:identifier>UDK: 620.1/.2:544.6</dc:identifier><dc:identifier>ISSN pri članku: 2574-0962</dc:identifier><dc:identifier>DOI: 10.1021/acsaem.2c00518</dc:identifier><dc:identifier>COBISS_ID: 110882307</dc:identifier><dc:language>sl</dc:language></metadata>
