Efficient heat dissipation is an increasingly critical challenge in modern electronics, where devices continue to shrink in size while increasing in power. Among advanced cooling methods for managing high heat fluxes, vapor chambers have gained prominence due to their ability to provide uniform temperature distribution through efficient heat transfer. Although this technology is well established, there remains significant potential for performance enhancement by integrating structured surfaces, alternative working fluids, and optimized chamber designs. In this work, a vapor chamber testing setup was developed to enable the assembly and evaluation of vapor chambers with adjustable heat input and variable geometric distribution of heat sources. The setup allows for precise temperature measurement and calculation of heat flux on both the source and sink sides. An uncertainty analysis of the measurements was conducted to ensure result reliability. Experimental tests were performed using vapor chambers featuring untreated and laser-structured copper surfaces with hydrophilic and hydrophobic properties. The results demonstrated a substantial improvement in heat dissipation when structured surfaces and water were used as the working fluid. Specifically, the thermal resistance of the vapor chamber was reduced by 45,2 % at a thermal load of 20 W.
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