We encounter the challenge of effectively cooling devices on a daily basis, as system overheating can lead to undesirable malfunctions and less efficient operation. To address this issue, we used infrared thermography to evaluate the temperature fields on a thin resistively heated metal surface, with the other side of this surface being cooled by a microchannel heat exchanger. We conducted experimental measurements at different fluid flow rates, applied different electrical power to the metal surface, and adjusted the number of microchannels in the heat exchanger. We presented temperature fields and graphs of temperature profiles along the length of the microchannel and across the width of the heat exchanger. Based on the findings from the results, we were able to achieve effective cooling of the majority of the thin metal surface in some cases.
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