The master thesis covers the issue of integrating electronic components into the housing, including a literature overview followed by concept design. With anlytic hierarchy process, we evaluate concepts and manufacturing technologies. Additionally, with numerical simulation, we can asses design solutions and optimizes the technology of the highest classified concept. Key material mechanical parameters of the housing are experimentally tested. It was discovered that for the provided application, the most appropriate technology is incapsulation potting. Moreover, with the construction selection, we can massively affect the tension on the PCB. To conclude, we discovered that with changing temperature curing, we could impact the mechanical properties of the material and consequently impact the tension into a polymer-electronic assembly.
|
