In blister packaging using the hot tool welding procedure, ink and other impurities transfer from the lidding material to the welding roller, degrading the weld quality to the point where the weld is no longer acceptable. In order to resolve this problem, we developed an optical system for monitoring accumulation of impurities on the welding roller, which captures and processes images. The results were tested and showed a low standard deviation of average brightness. The research identifies three possible solutions. Packaging delays can be reduced by monitoring the accumulation of impurities on the welding roller and determining when cleaning is required. Packaging delays can also be reduced by using the improved cleaning system developed on the basis of the results of the optical system. The greatest reduction in packaging delays would be possible by using the process-adapted label design on the lidding material.
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