Manufacturing of complex printed circuit boards in small series can lead to difficulties. Using of soldering iron stations is simple and used for many circuit boards, however the process is very time consuming. Also, due to large number of electronic components that it contains, the probability of an error during soldering is high. The alternative that appeared on the market is Reflowster, a simple controller that turns a kitchen oven in to a reflow soldering station.
In this thesis the controller is used for producing of a printed circuit board of a mobile robot RoboU3P. The goal is to manufacture a fully functional mobile robot in a time-acceptable period. The focus is directed towards basic reflow soldering, using mechanisms of appearance of most common deformations of joints, to learn to understand the temperature profile needed for producing quality joints.
The results show that there are two factors that cause the formation of deformations – the quantity of the soldering paste used and spacing between joints on the circuit board. By applying time optimizations, we have demonstrated that robot manufacturing can be faster and more efficient.
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